Nvidia reportedly wants all its HBM suppliers to use TSMC’s 3nm process

Samsung Electronics will make a core part of Nvidia’s custom memory chips on TSMC’s 3-nanometre process. The Seoul Economic Daily reported the move on Sunday, citing industry sources. It would be the first time the two have worked together on making high-bandwidth memory (HBM). The part is the base die, the logic layer at the […] This story continues at The Next Web

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