ASML’s chip packaging move threatens Besi shares, Bank of America says

Bank of America cut BE Semiconductor Industries to neutral and nearly halved its price target, saying the share price does not reflect the threat of ASML entering hybrid bonding, the market Besi depends on for growth. Besi has also been approached by two American rivals, one of which has owned 9% of it since last […] This story continues at The Next Web

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