New thermal insulator outperforms any material found in nature

Researchers have engineered a new material that is an extreme thermal insulator, is exceptionally stiff and can be printed as a thin film at large scales. The material has one of the lowest thermal conductivity profiles of any dense, or nonporous, material—approaching the theoretical limit of how good a material can be as a thermal insulator.

Read it at Phys.org ↗

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