SK Hynix breaks ground on a $4B memory packaging hub in Indiana

SK Hynix has broken ground on a plant costing more than $4B in West Lafayette, Indiana, its first US base for packaging high-bandwidth memory, with production due in the second half of 2029. Intel’s equivalent assembly and testing plant near Wroclaw was cancelled last year after state aid had been approved. SK Hynix has put […] This story continues at The Next Web

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